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IJREI- Analysis of Calorimetric Measurement Bismuth and Tin System

Downloads: 86 Avg Rating: 0.00 By: Mr Prashant Rai in 2016.
Lead-free soldering alloys with low melting point suitable for use in soldering joints are
very essential. Use of lead as a solder is considered dangerous for the environment due
to the huge number of printed circuit board and electronic devices, pipe joints etc.
needed to be recycled from dumps.
In this work the metallic samples were prepared from Bi in the mass range from 0.75gm.
Samples of Sn were dropped into the bath of pure Bi by using an automatic dropping
device. System required 40min time interval after every sample of dropped.
Calorimetric measurements was done at temperature 830K. The Integral and partial
enthalpy of mixing was calculated at this temperatures. The Integral enthalpy of mixing
in Bi- Sn system at 830K is endothermic in nature throughout the composition and its
maximumvalue at Xsn = 0.6, is 1005.9061 respectively.

Additional Authors: Kapil1, C.K Behra2, Ravinder Kumar3

Document Type: Article Topic Area: Education Submitted: 4th Nov 2016 Country: India
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